RFSOC 27DR RF-27DR-Lite 8CH 10MHz-6G RF Wireless Development Board -new

XCZU27DR RFSOC 27DR RF-27DR-Lite 8-Channel 10MHz-6GHz RF Wireless Development Board for ZYNQ

Master Chip Specification:
– Chip model: XCZU27DR-FFVE1156-2-i
– Clock recommended maximum speed: up to 775M for PLL/MMCM
– PS application processor model: four-core ARM Cortex-A53 1333MHz main frequency
– PS real-time processor model: dual-core ARM Cortex-R5 533MHz main frequency
– DDR specification model: DDR4, model of MT40A512M16LY-075:E
PS terminal: 4GB capacity, 64bit, 2400M
PL terminal: 2GB capacity, 32bit, 2666M
– Logic unit (LC): 930300
– Look-up unit (LUT): 425280
– DSP unit multiplier: 4272pcs
– Trigger (FlipFlops): 850560
– Block Ram: 38M Byte
– Ultra Ram: 22.5M Byte
– GTY (32.75G): 8pcs
– Component temperature range: -40℃ to 85℃

 – Speed level: -2
– Chip level: industrialRF-27DR-Lite Function Interface Description:
– Power supply/heat dissipation: powered through a dedicated DC5.5 interface, 12V input interface
– Development board clock: 33.33M(PS), 100M(PL), 26M(PS GTR), 156.25M(GTY)
– Ethernet: Gigabit RTL8211E, PS GEM3
– USB interface: USB3.0 SLAVE, support USB3.0, on PS
– Debugger: onboard UART + JTAG (FTDI solution) supports for ARM and FPGA development.
– Optical port: 1 QSFP28 100GE optical port, GTY, maximum line rate of 28Gbps
– EEPROM: one FM24C02 EEPROM, connected to PS
– SD card slot: PS SD1, 2.0 interface, bootable (SD supports up to 32GB)
– EMMC: SD0 of PS, with a capacity of 32GByte
– LED and buttons: power on/off/POR reset, PS/PL button/PL LED power status indicator/DONE indicator, USB indicator, etc.
– Boot setting switch: a BOOT dip switch for initiating settings
– Onboard FLASH: 128M bytes, two magnesium particles, PS
– Heat dissipation interface: two 12V heat dissipation interface, GH1.25-3P terminal
– Expansion IO port: introduce 20 3.3V single-ended TTL devices; 2Iane PS GTR; 4Iane GTY, the connector uses a 60P BTB connector
– Note 1: TYPE-C is only for USB connection and cannot provide power

RF Part Function Interface Parameter:
– ADC number: 8-channel 12-bit ADC, maximum sampling rate of 4.096Gbps
– DAC number: 8-channel 14-bit DAC, maximum sampling rate of 6.554Gbps
– RF range: 10M – 6GHz
– SNR: > 50dB at 1GHz below (better than 56dB for average)
– Isolation degree: about -60dB
– Channel consistency: the measured average error at DAC1G frequency is better than the range of 0.5dbm
– RF connector: MMCX female socket, requires MMCX male connector, other interfaces require adapter cables
– RF coupling mode: AC coupling mode, reserved ADCVCOM output
– Impedance control: RFSOC to Balun differential 100ohms, Balun to MMCX single-ended 50ohms

Package Included:
– 1 x Development Board
– 1 x Type-C 2.0 Cable
– 1 x Type-C 3.0 Cable
– 1 x 12V/5A DC Power Adapter
– 8 x MMCX RF Cable